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Extropic

Thermodynamic computing hardware.

HQ
Massachusetts
Founded
Jun 2022
Web
extropic.ai
Camps
Other substrates

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What it does

Extropic's thermodynamic sampling units compute with the noise of transistors rather than against it, sampling probabilities instead of doing matrix multiplies. In July 2026 the U.S. Commerce Department signed a $75M CHIPS letter of intent to scale and onshore its Z1 chip.

Camp membership over time

  1. dates not recorded
    Program search and other substrates
    Thermodynamic sampling chips; $75M CHIPS letter of intent.

Capital

AmountKindValuationDateInvestorsSource
$14Mseed Dec 2023 Kindred Ventures, Buckley Ventures, HOF Capital, OSS Capital, Valor Equity Partners SiliconANGLE
$75M reportedgovernment (letter of intent) Jul 2026 U.S. Department of Commerce, CHIPS R&D Non-binding letter of intent. PR Newswire

People

GVGuillaume VerdonFounder and CEO